Swing3D - Large
High-speed 3D Sensor providing 1,300,000 points of precise 3D data at once
Swing3D - Large
- High-speed 3D sensor
- 1.3 million 3D points
- Rotating line lasers allow 3D scans from fixed positions
- Top of the line FPGA and DSP
- GenIcam standard interface
- Extended FOV support
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Semiconductor -
Automotive -
Research and development -
Robotics
Specification
| Normal Mode - Clearance distance | 2300 mm |
|---|---|
| Normal Mode - Measurable depth distance | >1280 mm |
| Normal Mode - FOV | Near : 1334 x 1579 mm |
| Far : 1650 x 2456 mm | |
| Extended Mode - Clearance distance | 1900 mm |
| Extended Mode - Measurable depth distance | >2100 mm |
| Extended Mode - FOV | Near : 970 x 1304 mm |
| Far : 1755 x 2745 mm | |
| 3D acquisition time | <1000 mSec |
| Dimension / Weight | 94 x 80 x 832 mm / 2.8kg |
| Baseline | 767 mm |
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Inquiry
Headquarters : 30-18, Baekjegobun-ro 39-gil, Songpa-gu, Seoul, South-Korea
Sales office : 5F, 467, Songpa-daero, Songpa-gu, Seoul, South-Korea
TEL : +82-70-7122-1000 FAX : +82-70-7159-1315
Sales office : 5F, 467, Songpa-daero, Songpa-gu, Seoul, South-Korea
TEL : +82-70-7122-1000 FAX : +82-70-7159-1315
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